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  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
Application: Abrasives, Polishing, Cutting
Function: Polishing, Cutting
Particle Size: Powder, Abrasives,
Hardness: Superabrasive
Flexural Strength: 300-500MPa
Mohs Hardness: 9.36
Customization:

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