• High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
  • High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

Application: Abrasives, Polishing, Cutting
Function: Polishing, Cutting
Particle Size: Powder, Abrasives,
Hardness: Superabrasive
Flexural Strength: 300-500MPa
Mohs Hardness: 9.36
Customization:
Diamond Member Since 2019

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  • Overview
  • Product Description
  • Detailed Photos
  • Product Parameters
  • Application
  • Certifications
Overview

Basic Info.

Model NO.
F4-F2000
Compressive
3000-5000MPa
Transport Package
Paper Bag, Carton Box, Pallet, etc.
Specification
F4-F2000
Trademark
xingshi
Origin
China
HS Code
2849901000
Production Capacity
500-1000mt

Product Description

High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
 

Product Description


Shape:Sponge structure irregular shape
Material:Boron
Dimensions:-325mesh/ -200mesh/ 60um or on-demand processing
Chemical Composition:B,C, Fe2O3, B2O3
Item:coating and paint material boron carbide

Boron Carbide Powder (B4C)  is one of the hardest materials people know.
Its hardness with Mohs hardness 9.36 and microscopic hardness 5400-6300kg/mm2 is upon diamond nearly.
Its density is 2.52g/cm3 and melting point is 2450ºC.

It has excellent abrasion resistance and large neutron-absorbing cross section.
The boron carbide possesses properties of endurance hi/low temperature, no reaction with either acids or alkalis, high grinding efficiency,
no magnetism.

It is a good replacement of diamond.
Boron carbide also possesses the special properties of light quality, neutron absorbing, semi-conductivity, etc., so it is widely used in machinery, electronics, instrumentation, metallurgy, national defense, armed forces, nuclear, aviation 
industry, and also used as abrasives, classic refractory and specific welding materials, human protection materials and so on.

Detailed Photos

High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

 

Product Parameters

 

Physical Characteristics
Item Crystal system Crystal color Density Melting point Mohs hardness Micro hardness
Boron carbide Hexagonal Black 2.52g/cm3 2450ºC 9.36 5400-6300kg/mm2
 

Application

High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

 

High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

Certifications

 

High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230
Note: For more details, welcome to contact me.

We have many types of products in stock.
Prompt delivery is available.

If you have some special requirements, pls contact me directly.

 

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